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Dicing Saw
| MANUFACTURER | Disco |
|---|---|
| MODEL | Disco |
London Centre for Nanotechnology
| TRAINING | No special training required. |
|---|
| CONTACT 1 | Steve Etienne |
|---|---|
| Enquire about this item | |
| SITE | Bloomsbury Campus |
Description
Dicing saw capable of sawing flat substrates up to 150mm diameter.
Specification
We can saw Glass, Quartz, Silicon and other materials by suitable choice of blades.
Silicon dicing cuts
Typical: width 70 µm, depth 1000 µm
High precison: width 26 µm, depth 325 µm
Item ID #.
Last Updated: 17th January, 2014
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