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LCN Cleanroom Facility
| MANUFACTURER | Lamarflow |
|---|
London Centre for Nanotechnology
| RESTRICTIONS | Health and Safety Induction and specific equipment trainig required |
|---|---|
| TRAINING | Training is required to use this item and we can arrange this if needed. |
| CONTACT 1 | Steve Etienne |
|---|---|
| Enquire about this item | |
| SITE | Bloomsbury Campus |
Description
The Main clean room contains many items of specialist equipment equipment, that encompass the techniques of photo-lithography, Electron beam lithography, Chemical Etching and Cleaning, Physical Vapour Deposition, Plasma Etch and Plasma Deposition, and Characterisation.
The associated Back End Laboratory has equipment for cutting, assembly wire bonding and electrical testing.
The Smaller Cleanroom houses two Focused Ion Beam tools for Nanostructuring
Specification
Cleanroom Class ISO 6 (ISO Standard 14644-1) Class ISO 5 Workstations for photo lithography equipment Temperature 20 degrees C +- 2 degrees C Humidity 45%Rh to 55% Rh
Cleanroom Class ISO 7 (ISO Standard 14644-1) Temperature 20 degrees C +- 2 degrees C Humidity 45%Rh to 55% Rh
Associated Items
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Atomic Layer Deposition (ALD) Equipment
We have a Savannah S200 ALD system, equipped with 6 precursor ports, a fomblin vacuum pump, Ozone generator and a Quartz Crystal Monitor.
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Direct Write Laser Lithography
A system for performing Photolithography without need for Photomasks
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Electron Beam Lithography 100kV
Electron Beam Lithography
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Electron Beam Resist Spin Coating & Baking
Spin Coater and Hotplate dedicated for Electron Beam Resist
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Furnace Stack
A system containing four independent Furnace tubes for Silicon wafers up to 150mm diameter
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Orion NanoFab
Helium and Neon Scanning Ion Microscope for nanofabrication
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Reactive Ion Etcher
General Purpose Reactive Ion Etcher
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Shallow Reactive Ion Etcher
Chlorine and Fluorine chemistry Inductively Coupled Plasma RIE
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Spectroscopic Ellipsometer
For measurement of thin transparent films
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Sputter System
A four gun sputtering system plus Argon Ion Beam Milling capability
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Wafer Bonder
A system that can perform bonding of two flat substrates. Techniques include anodic, adhesive and direct bonding
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Wet Bench 2: Solvents
Dedicated to Solvent processes
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Item ID #.
Last Updated: 29th November, 2018
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