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LCN Atomic Force Microscopy
The London Centre for Nanotechnology (LCN) offers an extensive suite of atomic force microscopes for nano-scale surface characterisation and functional imaging under ambient conditions (gas/liquid), including a Bruker Multimode, a Bruker Dimension 31
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LCN Cleanroom Facility
The LCN Bloomsbury site has 255 m2 of Class 1000 (ISO 6) cleanroom housing the majority of the equipment including Electron Beam Lithography and an ISO7 facility which houses two Focused Ion Beam (FIB) lithography tools. There is also a Back End Lab
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LCN Confocal and fluorescent microscopy
Confocal and Fluorescent Microscopy facilities at LCN.
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Closed cycle dilution refrigerator, with load-lock and magnet
<10 mK base temperature, 3/1/1T vector magnet, fast sample exchange
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Dilution refrigerator, superconducting and high permeability shielding, multi rf, dc wiring and filtering
Dilution fridge with rf and dc wiring connections
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Direct Write Laser Lithography
A system for performing Photolithography without need for Photomasks
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Electron Beam Lithography 100kV
Electron Beam Lithography
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Electron Beam Resist Spin Coating & Baking
Spin Coater and Hotplate dedicated for Electron Beam Resist
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Everbeing EB-6 DC Probe Station
High precision probe station for DC wafer probing.
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Furnace Stack
A system containing four independent Furnace tubes for Silicon wafers up to 150mm diameter
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Magnetic Property Measurement System (MPMS-7)
The Magnetic Property Measurement System (MPMS) sample magnetometer utilises Superconducting Quantum Interference Device (SQUID) technology to achieve superior measurement sensitivity, dynamic range, and reproducibility otherwise unattainable.
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Multimode 8 AFM
The LCN has 3 Bruker MultiMode version 8 at the LCN each equipped with an E scanner or J scanner with heater and uses the unique PeakForce Tapping™ with ScanAsyst technology.
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Orion NanoFab
Helium and Neon Scanning Ion Microscope for nanofabrication
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Shallow Reactive Ion Etcher
Chlorine and Fluorine chemistry Inductively Coupled Plasma RIE
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Sputter System
A four gun sputtering system plus Argon Ion Beam Milling capability
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Wafer Bonder
A system that can perform bonding of two flat substrates. Techniques include anodic, adhesive and direct bonding
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Wet Bench 2: Solvents
Dedicated to Solvent processes
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